Spectroscopic ellipsometry is a powerful technique for characterizing the optical properties of thin films and surface layers. It is based on the measurement of the change in polarization of light as it interacts with a sample. When light is reflected from a surface, the reflected light has a polarization state that depends on the optical properties of the material. By measuring the change in polarization, spectroscopic ellipsometry can provide information about the thickness, refractive index, and extinction coefficient of the sample.

Confocal laser microscopy is an advanced optical imaging technique that provides high-resolution, three-dimensional (3D) images of a sample's surface or internal structure. It is widely used in various fields such as materials science, semiconductor inspection, and biological research. The key principle of confocal laser microscopy is the utilization of a pinhole to eliminate out-of-focus light, which significantly improves the axial resolution and image contrast compared to conventional wide-field microscopy.

Grinding and polishing is a technique used to remove surface material using abrasives, such as affixed SiC and suspended diamond, to produce a flat surface ideal for optical and electron microscopy. Uses SiC grinding papers, polishing cloths, diamond/silica/alumina available.

Oxford Instruments™ RF sputtering system can sputter on planar substrates maximum up to 8” wafer in size, hence, it keeps the space of accommodating various substrate sizes as per application needs. The system has four RF magnetron with a dedicated RF power supply. The system has three Mass Flow Controllers (MFCs) that are currently being used for the sputter gas. Generally, in a sputtering tool, a permanent magnet is set up behind the cathode-which is in contact with the loaded target to create electronic traps.

UV-VIS-NIR spectroscopy studies the interaction of matter with light in the ultraviolet, visible, and near-infrared regions (175 nm - 3300 nm) of the electromagnetic spectrum. It is widely used to measure the optical properties (transmittance, reflectance, and absorbance) of materials, mostly solids and liquids. It is extensively applied for characterization of a wide range of materials, such as thin films, coatings, glass, solar cells, and advanced materials research.

Transmission electron microscopy (TEM) is a microscopy technique in which a beam of electrons is transmitted through a specimen to form an image. The specimen is most often an ultrathin section less than 100 nm thick or a suspension on a grid. An image is formed from the interaction of the electrons with the sample as the beam is transmitted through the specimen. The image is then magnified and focused onto an imaging device, such as a fluorescent screen or a sensor, such as a scintillator attached to a charge-coupled device (CCD camera).

Dynamic Mechanical Analysis (DMA) is a versatile and widely used technique for characterizing the mechanical properties of materials, particularly polymers, composites, and biomaterials. DMA measures the response of a material to controlled deformation under controlled temperature and humidity conditions. The technique involves applying a sinusoidal deformation to a sample of known geometry and measuring the mechanical response in real-time using a force sensor and a displacement sensor.

Thermal mechanical analysis (TMA) is a highly precise and accurate technique used to characterize the physical changes of materials as a function of temperature and time under a controlled force. The technique involves the measurement of the initial length of the sample (l0), followed by the application of a controlled change in temperature and/or force. The resulting change in sample length (dl) is measured using an electrical transformer called a linear variable displacement transducer (LVDT).

X-ray diffraction (XRD) is a widely used nondestructive method in materials science, geology, environmental science, and biology for determining the atomic and molecular arrangements in crystalline materials. The technique involves irradiating a crystal with incident X-rays and measuring the intensities and angles of the scattered X-rays. The intensity of the scattered Xrays is then plotted as a function of the scattering angle, and the structure of the material is determined from the analysis of the location, in angle, and the intensities of scattered intensity peaks.

Optical microscopy is often the starting point for successful materials related failure and root cause analysis. It helps clients fully understand microstructure and other materials properties. The goal of optical microscopy is to produce clear and high quality images with high magnification (up to 1000X). Upright microscopes are the most common type, where the objective lens is above the stage and lighting system can be from top (reflected, bright field), bottom (transmitted) or sides (reflected, dark field).