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Grinding and polishing is a technique used to remove surface material using abrasives, such as affixed SiC and suspended diamond, to produce a flat surface ideal for optical and electron microscopy. Uses SiC grinding papers, polishing cloths, diamond/silica/alumina available.
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Techniques PDF Link
https://www.hbku.edu.qa/sites/default/files/grinding_and_polishing_0.pdf
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