General Sample Preparation

Sectioning is a technique used to reduce specimen size for easier handling and to fit in other equipment. Buehler IsoMet 5000 Linear Precision Saw The IsoMet 5000 linear precision saw is capable of automated and repeatable sectioning of hard materials. It also includes a smart cut function where it reduces the feed rate when hitting a particularly hard section to prevent damaging the sample and the machine.

Schmidt F, Abdesselem HB, Suhre K, Sohail MU, Al-Nesf M, Bensmail I, Mashod F, Sarwath H, Bernhardt J, Tan T.M, Morris P.E, Schenck E.J, Price D, Vaikath N.N, Mohamed-Ali V, Al-Maadheed M, Arredouani A, Decock J, Blackburn J.M, Choi A.M.K, and El-Agnaf O.

Schmidt F, Abdesselem HB, Suhre K, Sohail MU, Al-Nesf M, Bensmail I, Mashod F, Sarwath H, Bernhardt J, Tan T.M, Morris P.E, Schenck E.J, Price D, Vaikath N.N, Mohamed-Ali V, Al-Maadheed M, Arredouani A, Decock J, Blackburn J.M, Choi A.M.K, and El-Agnaf O.M. Auto-Immunoproteomics Analysis of COVID-19 ICU Patients Revealed Increased Levels of Autoantibodies Related to Male Reproductive System. Front Physiol. 2023 Jul 14;14:1203723. doi: 10.3389/fphys.2023.1203723. eCollection 2023. PMID: 37520825.

Differential Scanning Calorimetry (DSC)

Differential scanning calorimetry (DSC) is a widely used technique in materials science to investigate the thermal behavior of materials. The technique involves measuring the difference in heat flow between a sample and a reference material as the temperature is changed over a certain range. The sample is heated or cooled at a controlled rate, and the heat flow into or out of the sample is monitored using a set of thermocouples.

Profilometry

Profilometry is a branch of metrology that deals with the measurement and analysis of surface topography, focusing on the examination of surface roughness, waviness, and other surface features. By understanding a material's surface properties, researchers and engineers can optimize performance, durability, and functionality in various applications, such as electronics, optics, and medical devices. The fundamental theory behind profilometry involves capturing the height variations across a surface and analyzing the resulting profile data to quantify its characteristics.

Spectroscopic Ellipsometry

Spectroscopic ellipsometry is a powerful technique for characterizing the optical properties of thin films and surface layers. It is based on the measurement of the change in polarization of light as it interacts with a sample. When light is reflected from a surface, the reflected light has a polarization state that depends on the optical properties of the material. By measuring the change in polarization, spectroscopic ellipsometry can provide information about the thickness, refractive index, and extinction coefficient of the sample.

Grinding and Polishing

Grinding and polishing is a technique used to remove surface material using abrasives, such as affixed SiC and suspended diamond, to produce a flat surface ideal for optical and electron microscopy. Uses SiC grinding papers, polishing cloths, diamond/silica/alumina available.

Oxford Instruments™ RF sputtering system

Oxford Instruments™ RF sputtering system can sputter on planar substrates maximum up to 8” wafer in size, hence, it keeps the space of accommodating various substrate sizes as per application needs. The system has four RF magnetron with a dedicated RF power supply. The system has three Mass Flow Controllers (MFCs) that are currently being used for the sputter gas. Generally, in a sputtering tool, a permanent magnet is set up behind the cathode-which is in contact with the loaded target to create electronic traps.

Ultraviolet-Visible-Near Infrared Spectroscopy (UV-VIS-NIR)

UV-VIS-NIR spectroscopy studies the interaction of matter with light in the ultraviolet, visible, and near-infrared regions (175 nm - 3300 nm) of the electromagnetic spectrum. It is widely used to measure the optical properties (transmittance, reflectance, and absorbance) of materials, mostly solids and liquids. It is extensively applied for characterization of a wide range of materials, such as thin films, coatings, glass, solar cells, and advanced materials research.

Al-Nesf M.A.Y, Abdesselem HB, Bensmail I, Ibrahim S, Saeed WAH, Mohammed SSI, Razok A, Alhussain H, Aly RMA Al Maslamani M, Ouararhni K, Khatib M.Y, Ait Hssain A, Omrani A.S, Al-Kaabi S, Al Khal A, Al-Thani A.A, Samsam W, Farooq A, Al-Suwaidi J, Al-Maadhe

Al-Nesf M.A.Y, Abdesselem HB, Bensmail I, Ibrahim S, Saeed WAH, Mohammed SSI, Razok A, Alhussain H, Aly RMA Al Maslamani M, Ouararhni K, Khatib M.Y, Ait Hssain A, Omrani A.S, Al-Kaabi S, Al Khal A, Al-Thani A.A, Samsam W, Farooq A, Al-Suwaidi J, Al-Maadheedh M, Al-Siddiqi H.H, Butler A.E, Decock J.V, Mohamed-Ali V and Al-Ejeh F. Prognostic tools and candidate drugs based on plasma proteomics of patients with severe COVID-19 complications. Nature Commun. 2022 Feb 17;13(1):946.doi: 10.1038/s41467-022-28639-4.

Dynamic Mechanical Analysis (DMA)

Dynamic Mechanical Analysis (DMA) is a versatile and widely used technique for characterizing the mechanical properties of materials, particularly polymers, composites, and biomaterials. DMA measures the response of a material to controlled deformation under controlled temperature and humidity conditions. The technique involves applying a sinusoidal deformation to a sample of known geometry and measuring the mechanical response in real-time using a force sensor and a displacement sensor.